| 摘要 |
<p>PURPOSE:To eliminate the need for a black resin coating by mounting a light emitting device and a photodetector to the reverse side of a lead frame and preventing the photodetector from being affected by external light. CONSTITUTION:A lead frame 5 is mounted adjacently to a white resin 4 on the surface side of a photocoupler when its substrate mounting surface is assumed to be a reverse side. A light emitting device 1 and a photodetector 2 are mounted to the reverse side of the lead frame 5. Accordingly, when current flows in the light emitting device 1, light is incident on a boundary surface between a transparent resin 3 and the white resin 4 and on the side surfaces of the lead frame 5, and reflected light therefrom reaches the photodetector 2. In this case, incident light from external circumference is blocked by the lead frame 5 and does not reach the photodetector 2.</p> |
