| 摘要 |
A solid epoxy resin having a broad molecular weight distribution is prepared by melt or solution blending a major portion of a normally-solid epoxy resin having a weight per epoxide of about 1500 to about 10,000 and a minor portion of a normally-liquid epoxy resin having a weight per epoxide of from about 180 to about 340, and solidifying the resulting blend. A solvent-free powder coating composition is prepared by combining the blend with an effective amount of a curing agent and reducing the epoxy resin/curing agent to an average particle size less than about 60 mesh. The epoxy blend permits preparation of a powder coating formulation having improved grinding properties.
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