| 摘要 |
PURPOSE:To facilitate the treatment of a bridge part and to contrive to reduce the generation rate of defectives by a method wherein a copper circuit plate is formed by performing an etching treatment in a desired form including the bridge part and the removal of the bridge part is performed by cutting in the thickness direction of the copper circuit plate. CONSTITUTION:A copper plate 6 subjected to masking 9 is showered with a ferric chloride solution on both surfaces to perform an etching treatment and the copper plat 6 in a desired form having a plurality of insular parts 7 and a bridge part 8, which is removed by dissolution only from one side and is made into a thickness of about half of the initial thickness of the copper plate 6, is produced. Then, after the surface on one side, where the bridge part 8 is removed by dissolution, of the copper plate 6 is junctioned on a ceramics substrate 10, the bridge part 8 of the copper plate 6 is cut and removed by a sharp-edged cutter in the thickness direction of the copper plate 6 to produce a heat conductive substrate. Thereby, a junction failure of bulge, peeling and so on and the generation of burrs at the cut end parts can be prevented.
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