发明名称 WOOD FLOUR MATERIAL
摘要 PURPOSE:To provide a material which possesses conductivity and a fine look as lumber and is light in weight, by containing wood flour, a powdery conduc tive material and synthetic resin as components. CONSTITUTION:Wood flour, metallic powder and synthetic resin are weighed so that a weight ratio becomes 100:200:10 (process S1). Then water-resistant treatment and chemical treatment are performed to the wood flour by making use of a silicone repellent (process S2). The wood flour to which water-resistant treatment and chemical treatment have been performed is kneaded with the metallic powder and synthetic resin in a process S3. Cold press molding of this kneaded matter is performed at pressure of 50-80 kgf/cm<2>. A material obtained in this manner possesses favorable electric field shielding properties and magnetic field shielding properties and is superior in magnetic wave absorp tion properties. As the material is capable of performing electroplating, it can be used for manufacturing of a picture frame and Buddist altar fittings.
申请公布号 JPS63283906(A) 申请公布日期 1988.11.21
申请号 JP19870119130 申请日期 1987.05.18
申请人 NIPPON SEWING MACH T-BURU KOUGIYOUKUMIAI;ASAHI KORUKU KOGYO KK 发明人 YAMAWAKI KANAME;HONDA KAN;HONDA TAKESHI
分类号 B29B11/16;B29K103/06;C08J5/04;E04C2/52;H05K9/00 主分类号 B29B11/16
代理机构 代理人
主权项
地址