| 摘要 |
PURPOSE:To inhibit the expansion and contraction of an insulating resin due to a temperature change, and to obtain molding structure, in which there is no cracking in an IC chip and disconnection and the like, by disposing a sheet metal taking approximately the same external shape as a semiconductor element and consisting of a material having a thermal expansion coefficient lower than that of the insulating resin on the active surface side of the semiconductor element. CONSTITUTION:A sheet metal 6 taking approximately the same external shape as a semiconductor element 1 and composed of a material having a thermal expansion coefficient lower than an insulating resin 3 is arranged on the active surface 4 side of said semiconductor element 1 in a semiconductor device in which at least an active surface 4 in the semiconductor element 1 inner-lead bonded with conductor leads protruded into an opening section in an insulating plate 2 made up of a resin, etc. is molded with said insulating resin 3. Said sheet metal 6 is disposed so as to hold the insulating resin 3. Said structure is formed in such a manner that the insulating resin 3 is applied onto the IC chip 1 by printing or discharge by a dispenser, the sheet metal 6 is placed and pressed lightly, and the insulating resin 3 is heated and cured.
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