| 摘要 |
PURPOSE:To wire in high density and to obtain a multiwiring board having excellent insulation at high temperatures by using a composition containing epoxy resin and alkylation melamine resin as an adhesive coating film for bonding insulated wire to an insulating substrate, and the insulating film of insulated wire. CONSTITUTION:An adhesive coating film made of epoxy resin having 5000 or more of molecular weight and alkylation melamine resin is formed on a substrate for a multiwiring board. An insulated wire formed by coating a wire core or through an insulator coating layer the wire core with resin containing the epoxy resin containing 5000 or more of molecular weight and the alkylation melamine resin, and thermally curing it is laid on the adhesive coating film by a numerical control wiring machine, and simultaneously thermally melted by an ultrasonic vibration to be continuously bonded. Then, the wire is pressed by a press or the like to be tightly secured. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved. |
