发明名称 CURABLE RESIN COMPOSITION CONTAINING A MICROPARTICULATE SILICONE RUBBER
摘要 The curable resin composition of the present invention consists of a curable resin and the spherical microparticles of cued silicone rubber obtained by the curing of an addition reacting silicone rubber composition, wherein the silicone rubber composition also contains an epoxy compound having an aliphatically unsaturated group. Furthermore, because the microparticles are prepared from an aqueous emulsion or aqueous dispersion of the silicone rubber composition, it has an extremely small particle size.
申请公布号 AU2110888(A) 申请公布日期 1989.02.23
申请号 AU19880021108 申请日期 1988.08.19
申请人 TORAY SILICONE COMPANY, LTD. 发明人 YOSHITSUGU MORITA;NORIVASU YOKOYAMA;KEIJI YOSHIDA
分类号 B62D1/04;C08J3/12;C08L61/10;C08L63/00;C08L79/08;C08L83/04;C08L83/07;C08L83/08;C08L101/00 主分类号 B62D1/04
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