| 摘要 |
The invention relates to the manufacture of smart cards. When the smart cards are flat, as is the case when they are in credit-card format, they are subjected to bending and torsion which risks tearing out the integrated circuit micromodule from the cavity 12 in which it is housed. In order to limit this risk of tearing out, the invention proposes to form the cavity by a forging process, creating, in the cards, localised stresses all around the cavity. The edges of the cavity are thus hardened and the deformations of bending and torsion of the card are translated into a much smaller deformation of the cavity than in the prior art, giving rise to a limited risk of tearing out the micromodule. <IMAGE>
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