INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE: To effectively supply operation voltage to an wafer device by connecting 1st and 2nd strips to the conductors of 1st and 2nd groups. CONSTITUTION: A conductive bus 26 consists of a voltage strip 28 and an earth strip 30 extended in the horizontal direction crossing an wafer 12 and joined by a dielectric material and is constituted so as to come into contact with the surface of the wafer 12 and the strips 28, 30 are respectively connected to a voltage line 22 and an earth line 24 by soldering. Thus the necessary dimensions of the conductor can easily be obtained by arranging the voltage bus and the device is not restricted by necessity for supplying voltage from an edge part to a metalized conductor having small dimensions. Consequently voltage is applied to all points on the wafer.