| 摘要 |
<p>PURPOSE:To cause the life of a diamond blade to be elongated, while the radiation of heat is well achieved by a method in which the metallic body with a recessed part is provided on the main face of the stage having a cooling mechanism, and the fixing of a semiconductor wafer is carried out by freezing supplied water. CONSTITUTION:A metallic body 11 with a recessed part is placed on the main face of a stage 5, and is fixed thereto under vacuum attraction by the vacuum attraction groove 8 provided on the main face of this stage 5. Next, water enters the metallic body 11 with the recessed part from a water-feeding pipe 9, and the water is frozen into ice 10 in an instant by adding fluorocarbon gas, etc., into the cooling pipe 6 provided in the stage 5. A semiconductor wafer 3 is placed on the main face of this ice 10, and the ice 10 dissolves temporarily by the thermal energy contained in the semiconductor wafer 3 on the contact surface of said wafer with the ice 10, and then it is frozen again, whereby the semiconductor wafer 3 is perfectly fixed. This fixed semiconductor wafer 3 is dicing treated by a diamond blade 1, while cooling water is applied to said wafer from the jet nozzle 2 provided in near position.</p> |
