| 摘要 |
<p>PURPOSE:To enable diced semiconductor element chips to be fed to the next process while they are spread in the planar state on a wafer suction stage, by mounting the stage removably on an apparatus body while providing an externally operated on-off valve at the connecting section of the stage where vacuum holes thereof are connected to a vacuum source. CONSTITUTION:An adhesive sheet 2 on which a wafer 1 is adhered is arranged on a stage 3 and the wafer is diced while the sheet 2 is totally suction held by a vacuum supplied from a vacuum source through vacuum paths 4a, 7b and vacuum holes 4. When the dicing operation is finished, an on-off valve 5 is closed by means of a nob 6 and the wafer suction stage 3 is removed from an apparatus body 7. Thus, a vacuum is held within the vacuum holes 4 of the stage 3 and, therefore, the sheet 2 is still suction held on the stage 3 by the vacuum and kept extended in the planar state. Accordingly, the adhesive sheet 2 is not sagged or stretched, and therefore the edges 15 of each semiconductor element chip 11 do not hit the adjacent edge 15 of an adjacent chip 11. In this manner, the semiconductor element chips 11 can be prevented from flaws or cracks, effectively.</p> |
