| 摘要 |
PURPOSE:To enhance the mechanical properties of a formed plating film such as the elongation and tensile strength by adding inositol to an electroless copper plating soln. contg. alpha.alpha'-dipyridyl. CONSTITUTION:About 50-1,300mg/l inositol is added to an electroless copper plating soln. contg. a cupric salt, a complexing agent, a reducing agent, alkali hydroxide and alpha.alpha'-dipyridyl. A plating film deposited from the plating soln. has superior elongation and tensile strength, so a printed circuit board having high reliability can be produced by using the plating soln. |
