| 摘要 |
PURPOSE:To load a large number of semiconductor chips on one package, to decrease the number, of pins, to miniaturize and lighten the chips and to reduce cost by connecting the chips onto both main surfaces of a lead frame and connecting the chips to leads by wires on the same main surfaces of each chip. CONSTITUTION:A tab 1 in a lead frame, leads 2 arranged around the tab, semiconductor chips 3A, 3B and wires 4 are formed. In bonding by the wires of chip electrodes and the leads, every second lead is selected on a top face, and every other lead is choosed on an underside. A common connecting lead Z for joining two chips is shaped. A ceramic-case is used in place of a resin in packaging, and the chips can also be scaled by lead sections by a glass layer. |
