| 摘要 |
PURPOSE:To make it excellent in mechanical strength with small warp and torsion even if it is odd conductor layers by using a lead frame material for at least one layer of the conductor layers. CONSTITUTION:For a multilayer printed wiring board 10, at least one layer of conductor layers 3 is made of lead frame material 5. For example, the conductor layer 3 is formed by handling ones, in which circuits are formed by etching or stamping ones in copper line or 42 alloy line, similar to the inside layer core material 1 of the multilayer printed wiring board 10 so as to laminate them with prepreg and press them together. Hereby, a multilayer printed wiring board 10 strong in mechanical strength and also excellent in heat property can be obtained without warp or torsion even if it is odd conductor layers. |
