| 摘要 |
PURPOSE:To offset the loop height of a bonding wire with the thickness of a tab part so as to thin the thickness of a entire semiconductor device by pelleting and bonding the inner structure of a package on the main face of a semiconductor chip. CONSTITUTION:An outer lead part 2C is bent in U shape at the rear side of a resin sealing material 4 and stored within the thickness of a package main body. Accordingly, the thickness of a semiconductor device can be thinned by offsetting the height of a bonding wire 3 with the thickness of a tab part 2, and it can be made thinner by the amount of the thickness that the groove 5 for setting the outer lead part 2C to the bottom of the resin sealing material 4 is provided, and further a soldering part can be secured. And by making small space 6 between the outer lead part 2C and the bottom of the resin sealing material 4, the outer lead part 2C is made to have elasticity, whereby thermal fatigue at the outer lead part 2C can be reduced. |
