| 摘要 |
<p>a method of detecting a wiring pattern using triangulation to detect a height thereof, comprising the steps of scanning a light beam (3) from a light source, illuminating the wiring pattern (2) to be detected by the scanned light beam (3), focusing the light reflected from the wiring pattern (2) or a substrate (1), applying the focused light beam to a beam-splitter (6) which splits it into a transmitted portion and a reflected portion, and converting a wiring pattern configuration to a corresponding electrical signal by monitoring the transmitted and reflected portions. By blurring the image of the focused light entering the beam-splitter or by having a blurred division in the beam splitter (6a) an extension in the measurable height domain of the wiring pattern is possible. Furthermore, by applying a correction factor in response to the height of the substrate, the detected output of the wiring pattern height for a curved substrate can be sliced with a more appropriate slice level.</p> |
