| 摘要 |
<p>PURPOSE:To make a device compact and thin without deteriorating dielectric strength and moisture resistance by a method wherein a transparent resin layer on the back of a bed where each device of leadframes with light emitting and receiving devices being mounted is arranged is formed so that a part thereof is thick. CONSTITUTION:A light emitting diode as a light emitting device 1 and a photo transistor as a light receiving device 2 are mounted on leads 3, 4 so that they are opposed to each other and wire-bonded with gold wires 5, 5', respectively. After the light emitting device 1 is pre-coated 6 with silicon resin or the like in order to relax stress, this whole assembly is molded by light transmitting resin 7. After molding, the back of beds 9, 10 are made protruding. Then, the whole assembly is molded by light shielding resin 8 to form an optically coupled semiconductor device.</p> |
