| 摘要 |
The integrated circuit comprises a number of different types of standard LSI logic sections, each having a predetermined offthe-shelf logic configuration and wiring pattern. A glue circuit functionally couples the standard LSI logic sections, the glue circuit having a mask design standard suitable for the manufacturing process conditions as the manufacturing process conditions of the standard LSI logic sections. A wiring region selectively connects terminals between the standard LSI logic sections and the glue circuit. A bonding pad section surrounds the standard LSI logic sections and the glue circuit for connecting the terminals to lead wires.
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