| 摘要 |
<p>PURPOSE:To improve mechanical strength of a device and to avoide effect of thermal expansion by providing a slit section to a package of a wafer scale and by providing an electrode section to the slit section to realize packaging of a chip. CONSTITUTION:A slit section 3 is provided to a wafer 1 or a package 7 of a wafer scale to package a wafer, and an electrode section 6 is provided to the slit section 3 to package a chip to the wafer 1 and a scale, to make the chip removable against the electrode section 5 by use of the slit section 3, and to improve mechanical strength. Then a conductive reinforcing rubber 12A and an insulating reinforcing rubber 12B are provided to be commonly used as an electrode of an integrated circuit 14 to improve mechanical strength of the semiconductor device. Moreover, mismatching of thermal expansion coefficient which is generated when the semiconductor element 20 of the wafer scale if joined to a substrate 21, is eliminated, bending stress, etc., applied to the substrate 21 is made hard to be conducted to the element 20, and the problem of heat generation due to high integration of the element 20 is solved effectively.</p> |
