| 摘要 |
PURPOSE:To relax stress from a sealing resin and make a package thinner by lowering only a bonding pad part placed so that it surrounds a chip at the outermost side of a chip surface from the internal region where a transistor exists. CONSTITUTION:Only a bonding pad 3 which is placed so that it surrounds a chip at the outermost side of a chip surface 1 is lowered from an internal region where a transistor exists. Thus, since the part of the bonding pad 3 is at the lower part of the step, actual chip area is reduced and stress from a sealing resin is relaxed by that amount for improving reliability of a semiconductor device. Also, since the bonding pad 3 is lower than the chip surface 1, distance from the lowest surface of a die pad 5 to the highest point of a wire 2 is reduced, thus making thinner the package thickness. |
