发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To improve the pattern shape in lithography with a KrF excimer laser by using the compsn. prepd. by forming specific bis-(polyhalomethyl)- benzene to a p-vinyl phenol (co)polymer. CONSTITUTION:This compsn. is formed by adding the bis-(polyhalomethyl)- benzene as a photocrosslinking component to a polyvinyl phenol or hydroxy styrene/methyl methacrylate copolymer as a resin component. In the formula, X1 to X3 denote halogen or H; at least one of which is halogen. The more specific example of the formula includes the compd. expressed by formula II.
申请公布号 JPH03102355(A) 申请公布日期 1991.04.26
申请号 JP19890241215 申请日期 1989.09.18
申请人 SONY CORP 发明人 TSUMORI TOSHIRO
分类号 G03F7/038;H01L21/027 主分类号 G03F7/038
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