METHOD OF AND DEVICE FOR PLACING CHIP-TYPE ELECTRICAL AND/OR ELECTRONIC COMPONENTS ON A SUBSTRATE

摘要

A method of and a device for placing chip-type components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which has a number of pick-up elements, after which the pick-up device is moved to a position over the substrate and each of the pick-up elements in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant position by the pick-up element.