| 摘要 |
<p>PURPOSE:To make it possible to lessen the generation of a defective marred or damaged due to silicon dust produced at the time of braking when a chip is picked up by a method wherein the title device is provided with a reverse stage, a vertically moving unit, an X-Y table and a dust receiver. CONSTITUTION:A wafer braking device comprises a reverse stage 10, by which a wafer 3 is faced downward, a vertically moving unit 20, which is provided over the upper side of the stage 10 and can apply a pressure to the wafer 3 with a constant force from above the upper surface of the wafer 3, an X-Y table 30, by which the unit 20 can be moved in directions X and Y, and a dust receiver 40 provided in the lower direction of the table 30. Thereby, when this device is used, it becomes possible to remove sufficiently silicon dust, which are produced at the time of braking, before the next process, the generation of a defective due to the silicon dust is reduced and the improvement of the yield of the device and the improvement of the quality of the device are possible.</p> |
