| 摘要 |
PURPOSE:To obtain an IC package having lead parts where solder puddles are not generated at the time of mounting, by arranging a solder barrier part on lead parts except end portions capable of soldering to electrodes of a circuit board through bent parts, which barrier part is made of heat resistant material incapable of soldering and connects parts between the leads. CONSTITUTION:A solder barrier part 4 made of heat resistant material incapable of soldering is formed in the lead parts 2 of an IC package 1, so as to connect parts between the leads. Thereby solder can be prevented from staying in the bent parts 3 at the time of soldering of the lead parts 2 with cream solder or a dip tank. The solder barrier part 4 formed so as to connect the parts between the leads prevents deformation of the lead parts caused by external stress, and reinforces the lead parts 2. In the case of a OFF having a lead width wherein the pitch between the lead parts 2 is smaller than or equal to 0.5mm, especially effective reinforcement is attained. |
