| 摘要 |
<p>PURPOSE:To use an insulating substrate which is low in cost and excellent in processability and to simplify the manufacturing process of the light sources for image sensors by die-bonding LED chips and chips respectively incorporating a plurality of resistance bodies and provided with pads for connecting each resistance body to the insulating substrate. CONSTITUTION:LED chips D1, D2, D3, and D4 are respectively die-boned to patterns 5-1, 5-2, 5-3, and 5-4 for LED and a chip with a built-in resistance 8 is die-bonded to a pattern 7 for chip with a built-in resistance. The LED chips D1, D2, D3, and D4 are respectively bonded to wiring patterns 5-2, 5-3, 5-4, and 6 with wires (w). One or more or two or more resistance bodies are selected out of resistance bodies R1-R6 so that the smallest resultant resistance can be obtained to the value R0 of an adjusting resistance at which the optical outputs of the LED chips D1, D2, D3, and D4 can become the optimum. The pads 8c of the selected resistance bodies and a cathode electrode 4 and pads 8d and patterns 6 for wire bonding are respectively bonded to each other with wires w'.</p> |
