发明名称 Thermal head.
摘要 <p>The present invention enables simplification of the assembly of a thermal head (10) capable of performing a printing in a high density and high resolution and stable support of electrodes, and achieves an improvement in characteristics. A thermal head including a parallel flat cable composed of a plurality of electrode wires (2) flatly aligned in a polymer insulating coating (3), comprising a supporting body (4) made of a bonding agent and abundant in rigidity which encapsulates an end portion (2A) of the parallel flat cable directing to a printing plane over the polymer insulating coating or without providing the polymer insulating coating. &lt;IMAGE&gt;</p>
申请公布号 EP0451727(A2) 申请公布日期 1991.10.16
申请号 EP19910105433 申请日期 1991.04.05
申请人 SONY CORPORATION 发明人 SAKAMOTO, MITSUO, C/O SONY CORPORATION
分类号 B41J2/335 主分类号 B41J2/335
代理机构 代理人
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