| 摘要 |
<p>A novel micrometer apparatus is provided which is capable of providing strip workpiece thickness measurements with high precision and without operator dependence, the apparatus including a fixed anvil mounted to a "C" frame, a movable shaft mounted opposite the fixed anvil at a separation distance from the fixed anvil which represents the thickness of material therebetween, the fixed anvil being held in position by the full weight of the apparatus and the center of gravity of the apparatus passes through the fixed anvil and solidly against the top surface of the essentially horizontal strip being measured, an indicator having a measuring head for carrying the movable shaft which contacts the bottom side of the strip opposite the fixed anvil, and a display head positioned atop the micrometer apparatus above the strip such that the thickness measurement is performed and displayed automatically while the apparatus sits unattended on the workpiece. <IMAGE></p> |
