| 摘要 |
PCT No. PCT/GB89/00926 Sec. 371 Date May 15, 1990 Sec. 102(e) Date May 15, 1990 PCT Filed Aug. 11, 1989 PCT Pub. No. WO90/01803 PCT Pub. Date Feb. 22, 1990.A close-spaced diode array in which connection to driver circuitry is enabled by application of a flip-chip solder bonding technique. Not only does this allow dense packing, high pixel content to be achieved but has concomitant advantages of increased light efficiency and improved heat sinking.
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