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发明名称
METHOD FOR REPAIRING FLIP CHIP BONDING
摘要
申请公布号
JPH03253049(A)
申请公布日期
1991.11.12
申请号
JP19900049383
申请日期
1990.03.02
申请人
HITACHI LTD;HITACHI VLSI ENG CORP
发明人
AKASAKI HIROSHI;HORIUCHI HITOSHI;OTSUKA KANJI
分类号
H01L21/301;H01L21/60;H01L21/78
主分类号
H01L21/301
代理机构
代理人
主权项
地址
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