发明名称 METHOD FOR INSPECTING PHOTOMASK
摘要 PURPOSE:To inspect a foreign matter attached on a photomask in a short time and with high reliability by superposing the pattern of the first photomask and the pattern of the second photomask on a water and transferring them. CONSTITUTION:The first photomask (a) used for manufacturing a real device and the second photomask (b) that the opaque part 13 of a pattern area transferred on the wafer in the photomask is inverted on a transparent part 14 and the transparent part 14 is inverted on the opaque part 13 are produced. Then, in order to inspect the foreign matter attached on the first photomask (a), the pattern of the first photomask (a) and the pattern of the second photomask (b) are superposed at an identical place on the test wafer and transferred. At this time, only the foreign matter attached on one of the transparent part 14 becomes the pattern left on the wafer and a mask pattern is not formed on the wafer. Thus, the defect of the test wafer is inspected by eyes or a chip comparison type device for inspecting the defect of the wafer in a short time and with high reliability.
申请公布号 JPH0480755(A) 申请公布日期 1992.03.13
申请号 JP19900195302 申请日期 1990.07.23
申请人 MATSUSHITA ELECTRON CORP 发明人 NIIKE TAKUMI
分类号 G01N21/88;G01N21/94;G01N21/956;G03F1/84;H01L21/027;H01L21/30 主分类号 G01N21/88
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