发明名称 CONNECTING METHOD FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To prevent a conductive adhesive from protruding and to surely connect an electronic component to a board by a method wherein the electronic component is connected to the board by using a frame, for protrusion-preventing, which dams up the conductive adhesive. CONSTITUTION:An anisotropic conductive film 3 is sandwiched between an electronic component 1 and a board 11; a bonding tool 7 is lowered; the electronic component 1 is pressed to the board 11 by using the bonding tool 7; the electronic component 1 and the anisotropic conductive film 3 are heated; the anisotropic conductive film 3 is compressed. A resin adhesive 4 as the anisotropic conductive film 3 is spread a little to the outside; it comes into contact with a frame 12 and dammed up. In addition, the resin adhesive 4 is hardened; the electronic component 1 is connected to the board 11 in a state that an electric current can be applied. Thereby, the resin adhesive 4 which is compressed and spread can be dammed up by using the frame 12; it is possible to eliminate that the resin adhesive 4 becomes insufficient; the electronic component 1 can be connected to the board 11 wholly and surely.
申请公布号 JPH04142049(A) 申请公布日期 1992.05.15
申请号 JP19900264101 申请日期 1990.10.02
申请人 TOSHIBA CORP 发明人 AOYAMA HIDEHIKO
分类号 H01L21/60;H05K3/32 主分类号 H01L21/60
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