| 摘要 |
<p>PURPOSE:To double the number of bare chips to be mounted per unit area by sealing the chips mounted therein simultaneously upon laminating of a board. CONSTITUTION:A bare chip 2 is connected to a foot print 11-1a formed on an intermediate layer 11-3, surface layers 11-2 are superposed on both outside surfaces through adhesives 11-3, and heated. Then, the adhesives 11-3 are softened to flow to an air gap formed between the layers 11-1 and 11-2 to be formed by the thickness of the chip 2. When the adhesives 11-3 are cured, the chip 2 is sealed between the layers 11-1 and 11-2, and hence laminating of the layer 11-2 and sealing of the chip 2 can be performed in one step. In this case, other bare chip may be surface-mounted on the surface layer of a printed board with the bare chip. Thus, the number of the bare chips to be placed on the board per unit area can be doubled.</p> |
