| 摘要 |
<p>The present invention includes a thermoset receptor for radio signals having a frequency of about 1 to 100 MHz, the receptor having a dissipation factor of about 0.1 or greater and a dielectric constant of 0.1 or greater. Also disclosed are heat curable adhesives, film compositions, and composites comprising a thermoset and a thermoset receptor. The present invention also includes a method of curing a thermoset composition by applying radio signals having a frequency of about 1 to 100 MHz to a composition.</p> |
