| 摘要 |
PURPOSE:To enhance a productivity and a heat-radiating property regarding a semiconductor device as a resin package structure, its manufacturing method and a radiating fin. CONSTITUTION:At a semiconductor device constituted by installing a radiating fin 12 on a resin package 11 sealing a semiconductor element 13, the radiating fin 12 is constituted of a resin and is installed collectively at the resin package 11. As its manufacturing method, the semiconductor element 13 arranged on a stage 14a at a lead frame 14 molded in such a way that the stage 14a is revealed on the face of the package, the resin package 11 is formed, and, after that, the radiating fin 12 is resin-molded so as to come into contact with the revealed stage 14a. The radiating fin 12 is molded by using the resin in which a metal powder or an insulator powder as a filler is contained 10a molding resin. |
