发明名称 LEAD FRAME, MANUFACTURE THEREOF AND SEMICONDUCTOR IC DEVICE USING THE SAME
摘要 PURPOSE:To improve junction strength between a coated wire and an inner lead and improve reliability from the view point of its junction. CONSTITUTION:A plated layer 7 having a rougher surface than in the past is formed on the surface of an inner lead 5b of a lead frame 1, with which a coated wire 8 where the surface of a metal wire 8a is coated with a coating insulating film 8b. Then, when the coated wire 8 is to be joined with the inner lead 5b, the coated insulating film 8b of the coated wire 8 can be broken by the unevenness of the surface of the plated layer 7.
申请公布号 JPH04318961(A) 申请公布日期 1992.11.10
申请号 JP19910084971 申请日期 1991.04.17
申请人 HITACHI LTD 发明人 WATANABE HIROSHI;OKIKAWA SUSUMU;MIKINO HIROSHI
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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