| 摘要 |
<p>PURPOSE: To improve heat conductivity by performing formation from a diamond film wafer, provided with first and second surfaces and a coating surface provided with a thickness sufficient for filling all the recessed parts of the second surface on the second surface. CONSTITUTION: This substrate 10 is constituted of a diamond wafer 12 provided with a coarse surface 14 where crystals are deposited and a smooth surface 16 for depositing and growing the crystals on an opposite side. For the coarse surface 14, after forming a coating layer 18 by thinly applying an appropriate adhesive, the coating layer 18 is hardened, the surface finish of an exposed surface 19 is performed and is smoothed and practically matched with the smooth surface 16. That is, the thickness of the coating surface 18 is turned into a thickness for filling all the recessed parts of the coarse surface 14 and hiding a highest projected point and the surface 19 is matched so as to be parallel to the smooth surface 16. Thus, the heat conductivity of the laminated diamond substrate 10 is improved.</p> |
