| 摘要 |
<p>PURPOSE:To make it possible to maintain a constant amount of standoff when packaging a printed board and hence clean flux satisfactorily after it is mounted by forming a package support projection on a package side for a resin-sealed printed board. CONSTITUTION:An IC chip is molded with sealing resin 14 while an outer lead 12 to be electrically connected with a printed board, is pulled out from the sealing resin 14. In such a tape carrier type semiconductor device, it is arranged that a package support projection be formed on a package side of a resin-sealed printed board 16. More specifically, package support projections 220 are integrally molded on the bottom of the resin-sealed package side at the four corners respectively. This construction makes it possible to maintain a constant amount of standoff 20 between the sealing resin 14 and the printed board 16 all the time. It is, there fore possible to eliminate flux by cleaning after it is mounted.</p> |
