| 摘要 |
PURPOSE:To obtain a thick film circuit board and its manufacturing method which board has a high precision resistance part and a copper circuit wiring part excellent in conducting characteristics which are formed by binary baking, and a solder land part excellent in solder wettability. CONSTITUTION:After noble metal paste is printed on the surface of a ceramic substrate 1, a solder land part 2 is formed by baking in an oxidizing atmosphere. After gold paste and resistance paste are printed, and then a gold pad part 8 and a resistance part 6 are formed by simultaneous or individual baking in an oxidizing atmosphere, copper paste is printed and a circuit wiring part 5 is formed by baking in a non-oxidizing atmosphere, thus forming a thick film circuit board. |
