发明名称 TAPING METHOD FOR ELECTRONIC PART
摘要 PURPOSE:To prevent falling-off or deformation by external force from occurring to external lead wires interposed between a paper mount and an adhesive tape and fixed by taping for forming an electronic part by a method wherein a part or the whole of the external lead wires is formed in advance in L shape, and fixing of the N lead wire by taping is made by interposing the formed part between the tape and the paper mount. CONSTITUTION:A radial type electronic part is composed of a mold part 1 and external lead wires 2, and the external lead wires 2 are, as shown in the attached figure, formed in advance in L-shape. The length of this formation is desirable to be 2-10 times the width of the external lead wire. Then the formed parts of the external. lead wires 2 are placed on a paper mount 5 and are fixed with an adhesive tape 4, and taping is completed therewith. Thereby, effective area of adhesion can be ensured sufficiently in the two-dimensional direction.
申请公布号 JPH0516908(A) 申请公布日期 1993.01.26
申请号 JP19900309716 申请日期 1990.11.15
申请人 NEC YAMAGATA LTD 发明人 TAKEDA SHINICHI
分类号 B65B15/04;H01G13/00 主分类号 B65B15/04
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