| 摘要 |
1. The adhesive-filling compound containing epoxy resin, amine hardener, and/or modifying agents consisting in that its composition includes 100 parts by weight of epoxy resin, from 0.01 to 85 parts of weight of the amine hardener obtained as a result of a chemical reaction at elevated temperature in the alkaline solution of 2-methylimidazole with a molar excess of acrylonitrile and/or equivalent quantity of the amine hardener obtained as a result of a chemical reaction at elevated temperature of the hardener which was a product of the reaction referred to above with KOH solution, possibly with addition of other hardeners, fillers or modifying agents.
|
