| 摘要 |
The compact thermal head comprises a thin film layer (64) composing of a heating resistor (61), connector (62), and common line (63), ICS (67) driving the heating resistor, and PCB (65). The thin film layer and the PCB are placed on the top of a heat sink (66). The ICs are formed in row on the PCB to connect between the input electrode pad of the IC and the connector pad of the PCB with gold wires (69-71). |
