| 摘要 |
<p>PURPOSE:To increase the heat radiating area of a chip so as to improve the heat radiating effect of the chip by providing dummy pins which are wire-bonded to dummy pads on the chip. CONSTITUTION:Dummy pads 3a formed on a chip 2 are connected to dummy pins 6 through wires 5. The heat generated by the chip 2 is radiated to the outside from the dummy pins 6 after the heat is transferred to the dummy pins 6 through pads 3, the dummy pads 3a, the wires 5, and input-output pins 4 in this order.</p> |
