OUTER LEAD TAPE AUTOMATED BONDING SYSTEM

摘要

A method for aligning and bonding the outer leads (20) of the conductive fingers (16, Fig.3) of a tape-and-semiconductor-chip sub-assembly to a package substrate (12) is disclosed. Each section of tape is provided with an inner support ring (18) and an outer support ring (22). The conductive fingers extend from under the inner support ring (18) to under the outer support ring (22). The outer support ring (22) is spaced away from the inner support ring (18) to expose portions (23) of the tape outer leads (20) therebetween. The tape-and-chip sub-assembly (10) is positioned over the package substrate (12) so the outer leads (20) are in register with the appropriate package substrate leads (26). A deposit of flux (28) is applied to at least one location (30) between the substrate (18) and outer support ring (22) to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.