| 摘要 |
A heat block of a wire bonding machine including an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame, a chip heating part for bonding the other ends of the wires to a semiconductor chip, and a differentially heating member for heating the inner lead heating part of the heat block at a relatively higher temperature than that of the chip heating part of the heat block. The heat block of this invention provides advantage in that the chip heating part is heated at a proper heating temperature, at which temperature the semiconductor chip is not injured, while the inner lead heating part is heated at a relatively higher temperature than that of the chip heating part, thereby considerably improving the bonding effect at the bonding portions between the wires and the inner leads of the lead frame owing to the relatively higher heating temperature of the inner lead heating part than that of the chip heating part.
|
