发明名称 ELECTRONIC PARTS AND BONDING METHOD THEREOF
摘要 PURPOSE:To prevent the generation of defective parts and to enable crossover wiring in fine patterns by forming a wire for wiring to a state of supporting this wire with a prebonding part. CONSTITUTION:The wire 2 for wiring is bonded like a ball to a conductor 1b before the wire is bonded to the conductor 1a, by which the prebonding part 6 is provided slightly nearer the conductor 1c than the 2nd bonding part 4. A capillary is then moved onto the conductor 1a and a spherical part is formed at the end of the wire 2 for wiring projecting from the capillary This spherical part is press welded and connected to the 1st bonding part 3 of the conductor 1a. The capillary is thereafter moved onto the conductor 1a in such a manner that the wire 2 for wiring passes right above the prebonding part 6 and the wire 2 for wiring is press welded and connected to the 2nd bonding part 4. The wire 2 for wiring is, therefore, pressed and supported to the prebonding part 6 in the 2nd bonding part 4 and is lifted in the direction parting from the conductor 1a. A sufficient spacing is obtd. therebetween.
申请公布号 JPH05150253(A) 申请公布日期 1993.06.18
申请号 JP19910342494 申请日期 1991.11.29
申请人 KYOCERA CORP 发明人 ARITOME MASAHITO
分类号 G02F1/1345;H01L21/60 主分类号 G02F1/1345
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