发明名称 THICK FILM MATERIAL FORMING METHOD
摘要 <p>PURPOSE:To provide the forming method of a thick film material with which the thick film material can be arranged in high density by a method wherein oozing is very hard to occur when the thick film material, such as an electrode film, a resistance film and the like, is printed. CONSTITUTION:The thick film material such as electrodes 2 and 3, a resistance film 6 and the like are printed on the surface of a substrate 1 in such a state that paste material non-existing regions 2a, 3a and 6a are scattered, and after the above-mentioned printing operation has been finished, the paste material is oozed on the circumference of the paste material non-existing regions 2a, 3a and 6a, and the paste material non-existing regions 2a, 3a and 6a are eliminated.</p>
申请公布号 JPH05205912(A) 申请公布日期 1993.08.13
申请号 JP19920012934 申请日期 1992.01.28
申请人 MURATA MFG CO LTD 发明人 AZUMA SHIGEKI
分类号 H01C17/06;H05K3/12 主分类号 H01C17/06
代理机构 代理人
主权项
地址