| 摘要 |
<p>PURPOSE:To provide a thick film chip resistor with which the diffusion of silver, which is the component of a conductor film into a resistor film can be prevented. CONSTITUTION:In a thick film chip resistor on which an Ag/Pd conductor film 12 is provided on the opposing sides of an alumina substrate 10, a resistor film 11, which comes in contact with the conductor film 12, is formed on the substrate 10; an Au film 1 is interposingly provided on the contact part (overlapped part) between the Ag/Pd conductor film 12 and the resistor film 11. As a result, the silver, which is the component of the conductor film 12, is not diffused into the resistor film 11.</p> |
