| 摘要 |
The printed circuit board has a copper under-side and a printed circuit layer on top. An end section carries the high current section (14-50 amps). The copper layer on the under-side is thin, which is adequate for normal operation. In order to adapt this board to high current use, a thicker layer of copper (11) is sandwiched between the copper under-side and a second isolating board (1 ter). The sandwich is held in place by rivets (7) which pass through cleared holes in the circuit board and subsidiary board. A relay is inserted (14) into the main board and held in place by a clip to effect switching to this section. Thus the amount of copper used is reduced for this packing density. ADVANTAGE - Simplifies and lowers cost of connections. Allows smaller dimension circuits with higher current.
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