发明名称 |
BOITIER POUR CIRCUITS HYBRIDES |
摘要 |
A housing for hybrid circuits, especially electronic or optronic thick-film circuits having a protective-gas filling in the space which is surrounded by a cover and is hermetically sealed. The substrate is at the same time the housing base, and the cover can be connected directly to it. The substrate advantageously consists of ceramic and is coated with a metal layer on its outside for electromagnetic screening. A thick-film pattern for populating with monolithically integrated circuits and other components is applied on the side of the substrate facing the interior. |
申请公布号 |
FR2629664(B1) |
申请公布日期 |
1993.12.03 |
申请号 |
FR19890000216 |
申请日期 |
1989.01.10 |
申请人 |
MESSERSCHMITT BOLKOW BLOHM GMBH |
发明人 |
HORST RIEDELBAUCH;SIEGFRIED GUBER |
分类号 |
H01L23/055;H01L23/538;H01L25/16;H05K1/02;H05K5/00 |
主分类号 |
H01L23/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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