| 摘要 |
PURPOSE:To lessen a mounting part in area for short-circuiting by a method wherein a required circuit is shorted by injecting solder into a prescribed hole provided to a circuit board without using a jumper wire. CONSTITUTION:A multilayer printed board 1 is provided with a power supply layer 2, a GND layer 3, and others internally formed in it, the layers and a wiring pattern formed on the surface of the board 1 are made to communicate with one another through holes 5a to 5c provided at prescribed points, and if necessary, solder is made to flow into the holes 5a to 5c, whereby the wiring pattern and the layers are connected together or the wiring pattern and a wiring pattern 7 formed on the rear of the multilayer printed board 1 are connected together. |
